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Microprocessors And MicrosystemsSCIE

国际简称：MICROPROCESS MICROSY 参考译名：微处理器和微系统

中科院分区
4区
CiteScore分区
Q1
JCR分区
Q2

基本信息：: ISSN：0141-9331; E-ISSN：1872-9436; 是否OA：未开放; 是否预警：是; TOP期刊：否

出版信息：: 出版地区：NETHERLANDS; 出版商：Elsevier; 出版语言：English; 出版周期：Bimonthly; 出版年份：1978; 研究方向：工程技术-工程：电子与电气

评价信息：: 影响因子：1.9; H-index：33; CiteScore指数：6.9; SJR指数：0.549; SNIP指数：1.003

发文数据：: Gold OA文章占比：4.46%; 研究类文章占比：96.55%; 年发文量：145; 自引率：0.0384...; 开源占比：0.0216; 出版撤稿占比：0.0031...; 出版国人文章占比：0; OA被引用占比：0.0147...

投稿咨询加急见刊

英文简介期刊介绍 CiteScore数据中科院SCI分区 JCR分区发文数据常见问题

英文简介Microprocessors And Microsystems期刊介绍

Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).

Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.

期刊简介Microprocessors And Microsystems期刊介绍

《Microprocessors And Microsystems》自1978出版以来，是一本计算机科学优秀杂志。致力于发表原创科学研究结果，并为计算机科学各个领域的原创研究提供一个展示平台，以促进计算机科学领域的的进步。该刊鼓励先进的、清晰的阐述，从广泛的视角提供当前感兴趣的研究主题的新见解，或审查多年来某个重要领域的所有重要发展。该期刊特色在于及时报道计算机科学领域的最新进展和新发现新突破等。该刊近一年被列入预警期刊名单，目前已被权威数据库SCIE收录，得到了广泛的认可。

该期刊投稿重要关注点：

预计审稿时间：较慢,6-12周
计算机科学
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
SCIE
中科院4区
预警

Cite Score数据（2024年最新版）Microprocessors And Microsystems Cite Score数据

CiteScore：6.9
SJR：0.549
SNIP：1.003

学科类别	分区	排名	百分位
大类：Computer Science 小类：Computer Networks and Communications	Q1	93 / 395	76%
大类：Computer Science 小类：Hardware and Architecture	Q2	45 / 177	74%
大类：Computer Science 小类：Software	Q2	109 / 407	73%
大类：Computer Science 小类：Artificial Intelligence	Q2	108 / 350	69%

CiteScore 是由Elsevier(爱思唯尔)推出的另一种评价期刊影响力的文献计量指标。反映出一家期刊近期发表论文的年篇均引用次数。CiteScore以Scopus数据库中收集的引文为基础，针对的是前四年发表的论文的引文。CiteScore的意义在于，它可以为学术界提供一种新的、更全面、更客观地评价期刊影响力的方法，而不仅仅是通过影响因子(IF)这一单一指标来评价。

历年Cite Score趋势图

中科院SCI分区Microprocessors And Microsystems 中科院分区

中科院 2023年12月升级版 综述期刊：否 Top期刊：否

大类学科	分区	小类学科	分区
计算机科学	4区	COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机：硬件 COMPUTER SCIENCE, THEORY & METHODS 计算机：理论方法 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	4区 4区 4区

中科院分区表 是以客观数据为基础，运用科学计量学方法对国际、国内学术期刊依据影响力进行等级划分的期刊评价标准。它为我国科研、教育机构的管理人员、科研工作者提供了一份评价国际学术期刊影响力的参考数据，得到了全国各地高校、科研机构的广泛认可。

中科院分区表 将所有期刊按照一定指标划分为1区、2区、3区、4区四个层次，类似于“优、良、及格”等。最开始，这个分区只是为了方便图书管理及图书情报领域的研究和期刊评估。之后中科院分区逐步发展成为了一种评价学术期刊质量的重要工具。

历年中科院分区趋势图

JCR分区Microprocessors And Microsystems JCR分区

2023-2024 年最新版

按JIF指标学科分区	收录子集	分区	排名	百分位
学科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q3	42 / 59	29.7%
学科：COMPUTER SCIENCE, THEORY & METHODS	SCIE	Q2	60 / 143	58.4%
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	211 / 352	40.2%

按JCI指标学科分区	收录子集	分区	排名	百分位
学科：COMPUTER SCIENCE, HARDWARE & ARCHITECTURE	SCIE	Q3	32 / 59	46.61%
学科：COMPUTER SCIENCE, THEORY & METHODS	SCIE	Q2	67 / 143	53.5%
学科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q3	179 / 354	49.58%

JCR分区的优势在于它可以帮助读者对学术文献质量进行评估。不同学科的文章引用量可能存在较大的差异，此时单独依靠影响因子(IF)评价期刊的质量可能是存在一定问题的。因此，JCR将期刊按照学科门类和影响因子分为不同的分区，这样读者可以根据自己的研究领域和需求选择合适的期刊。

历年影响因子趋势图

本刊中国学者近年发表论文

1、Power Inspection Design by Internet of Things and RFID Technology in Smart City
Author: Yang, Bo; Tang, Jun; Dong, Xiaofeng; Li, Shi; Gu, Ren; Hao, Junhua

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104510
2、A simple and effective multi-person pose estimation model for low power embedded system
Author: Li, Hua; Wen, Shiping; Shi, Kaibo

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104739
3、A lattice Boltzmann model for the Navier-Stokes equation
Author: Xu, Wenchao; Yan, Guangwu

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2021.104391
4、Road surface state recognition using deep convolution network on the embedded device
Author: Gin, QiXin; Wang, Guangying; Wang, Lei; Cheng, Jun; Fang, Hao

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104740
5、A new idea in response to fast correlation attacks on small-state stream ciphers
Author: Ghafari, Vahid Amin; Lin, Fujiang; Zhou, Zhongzhi

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 96, Issue , pp. -. DOI: 10.1016/j.micpro.2022.104720
6、Lightweight image super-resolution via overlapping back-projection feedback network for embedded devices
Author: Wang, Beibei; Liu, Changjun; Yan, Binyu; Jeon, Seunggil; Yang, Xiaomin; Zhang, Zhuoyue

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104777
7、Convolutional networks with short-term memory effects
Author: Gong, Chencheng; Chen, Ling; Liu, Xin

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104779
8、An end-to-end medical image fusion network based on Swin-transformer
Author: Yu, Kaixin; Yang, Xiaoming; Jeon, Seunggil; Dou, Qingyu

Journal: MICROPROCESSORS AND MICROSYSTEMS. 2023; Vol. 98, Issue , pp. -. DOI: 10.1016/j.micpro.2023.104781