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Journal Of Micromechanics And Microengineering

Journal Of Micromechanics And MicroengineeringSCIE

国际简称:J MICROMECH MICROENG  参考译名:微机械与微工程杂志

  • 中科院分区

    4区

  • CiteScore分区

    Q2

  • JCR分区

    Q2

基本信息:
ISSN:0960-1317
E-ISSN:1361-6439
是否OA:未开放
是否预警:否
TOP期刊:否
出版信息:
出版地区:ENGLAND
出版商:IOP Publishing Ltd.
出版语言:English
出版周期:Monthly
出版年份:1991
研究方向:工程技术-材料科学:综合
评价信息:
影响因子:2.4
H-index:119
CiteScore指数:4.5
SJR指数:0.476
SNIP指数:0.789
发文数据:
Gold OA文章占比:13.91%
研究类文章占比:95.62%
年发文量:137
自引率:0.0434...
开源占比:0.0884
出版撤稿占比:0
出版国人文章占比:0.31
OA被引用占比:0.0241...
英文简介 期刊介绍 CiteScore数据 中科院SCI分区 JCR分区 发文数据 常见问题

英文简介Journal Of Micromechanics And Microengineering期刊介绍

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.

The journal is focussed on all aspects of:

-nano- and micro- mechanical systems

-nano- and micro- electomechanical systems

-nano- and micro- electrical and mechatronic systems

-nano- and micro- engineering

-nano- and micro- scale science

Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.

Below are some examples of the topics that are included within the scope of the journal:

-MEMS and NEMS:

Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.

-Fabrication techniques and manufacturing:

Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.

-Packaging and Integration technologies.

-Materials, testing, and reliability.

-Micro- and nano-fluidics:

Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.

-Lab-on-a-chip and micro- and nano-total analysis systems.

-Biomedical systems and devices:

Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.

-Energy and power:

Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.

-Electronics:

Including flexible electronics, wearable electronics, interface electronics.

-Optical systems.

-Robotics.

期刊简介Journal Of Micromechanics And Microengineering期刊介绍

《Journal Of Micromechanics And Microengineering》自1991出版以来,是一本工程技术优秀杂志。致力于发表原创科学研究结果,并为工程技术各个领域的原创研究提供一个展示平台,以促进工程技术领域的的进步。该刊鼓励先进的、清晰的阐述,从广泛的视角提供当前感兴趣的研究主题的新见解,或审查多年来某个重要领域的所有重要发展。该期刊特色在于及时报道工程技术领域的最新进展和新发现新突破等。该刊近一年未被列入预警期刊名单,目前已被权威数据库SCIE收录,得到了广泛的认可。

该期刊投稿重要关注点:

Cite Score数据(2024年最新版)Journal Of Micromechanics And Microengineering Cite Score数据

  • CiteScore:4.5
  • SJR:0.476
  • SNIP:0.789
学科类别 分区 排名 百分位
大类:Engineering 小类:Mechanical Engineering Q2 207 / 672

69%

大类:Engineering 小类:Mechanics of Materials Q2 146 / 398

63%

大类:Engineering 小类:Electrical and Electronic Engineering Q2 292 / 797

63%

大类:Engineering 小类:Electronic, Optical and Magnetic Materials Q2 118 / 284

58%

CiteScore 是由Elsevier(爱思唯尔)推出的另一种评价期刊影响力的文献计量指标。反映出一家期刊近期发表论文的年篇均引用次数。CiteScore以Scopus数据库中收集的引文为基础,针对的是前四年发表的论文的引文。CiteScore的意义在于,它可以为学术界提供一种新的、更全面、更客观地评价期刊影响力的方法,而不仅仅是通过影响因子(IF)这一单一指标来评价。

历年Cite Score趋势图

中科院SCI分区Journal Of Micromechanics And Microengineering 中科院分区

中科院 2023年12月升级版 综述期刊:否 Top期刊:否
大类学科 分区 小类学科 分区
工程技术 4区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理:应用 4区 4区 4区 4区

中科院分区表 是以客观数据为基础,运用科学计量学方法对国际、国内学术期刊依据影响力进行等级划分的期刊评价标准。它为我国科研、教育机构的管理人员、科研工作者提供了一份评价国际学术期刊影响力的参考数据,得到了全国各地高校、科研机构的广泛认可。

中科院分区表 将所有期刊按照一定指标划分为1区、2区、3区、4区四个层次,类似于“优、良、及格”等。最开始,这个分区只是为了方便图书管理及图书情报领域的研究和期刊评估。之后中科院分区逐步发展成为了一种评价学术期刊质量的重要工具。

历年中科院分区趋势图

JCR分区Journal Of Micromechanics And Microengineering JCR分区

2023-2024 年最新版
按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 170 / 352

51.8%

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 29 / 76

62.5%

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 102 / 140

27.5%

学科:PHYSICS, APPLIED SCIE Q3 96 / 179

46.6%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 200 / 354

43.64%

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q3 46 / 76

40.13%

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 82 / 140

41.79%

学科:PHYSICS, APPLIED SCIE Q3 106 / 179

41.06%

JCR分区的优势在于它可以帮助读者对学术文献质量进行评估。不同学科的文章引用量可能存在较大的差异,此时单独依靠影响因子(IF)评价期刊的质量可能是存在一定问题的。因此,JCR将期刊按照学科门类和影响因子分为不同的分区,这样读者可以根据自己的研究领域和需求选择合适的期刊。

历年影响因子趋势图

发文数据

2023-2024 年国家/地区发文量统计
  • 国家/地区数量
  • CHINA MAINLAND249
  • USA121
  • Japan42
  • India38
  • South Korea36
  • GERMANY (FED REP GER)33
  • Canada27
  • Taiwan23
  • England19
  • France18

本刊中国学者近年发表论文

  • 1、Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators

    Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/ac8bde

  • 2、Remote actuation based on magnetically responsive pillar arrays

    Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/aca20f

  • 3、Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

    Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca913

  • 4、Topology optimization design of compliant amplification mechanisms with low parasitic displacement

    Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca4dc

  • 5、An ionic pressure sensor array with digitizable sensitivity

    Author: Zou, Qiang; Liu, Chenyu; Su, Qi; Xue, Tao

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc873

  • 6、Identification and suppression of driving force misalignment angle for a MEMS gyroscope using parametric excitation

    Author: Zheng, Xudong; Wang, Xuetong; Shen, Yaojie; Xia, Chenhao; Tong, Wenyuan; Jin, Zhonghe; Ma, Zhipeng

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc6

  • 7、Research on high temperature performance of pressure sensor

    Author: Zhao, Zhiqiang; Pan, Shuliang; Memon, Maria Muzamil; Liu, Qiong; Wang, Tao; Zhang, Wanli

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc6dd

  • 8、Developing a multi-sample acoustofluidic device for high-throughput cell aggregation

    Author: Yang, Renhua; Huang, Siping; Zhang, Yiwen; Zhang, Chao; Qian, Jingui; Lam, Raymond H. W.; Lee, Joshua E-Y; Wang, Zuankai

    Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc5

投稿常见问题

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