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Ieee Transactions On Software Engineering

Ieee Transactions On Software EngineeringSCIE

国际简称:IEEE T SOFTWARE ENG  参考译名:IEEE软件工程汇刊

  • 中科院分区

    1区

  • CiteScore分区

    Q1

  • JCR分区

    Q1

基本信息:
ISSN:0098-5589
E-ISSN:1939-3520
是否OA:未开放
是否预警:否
TOP期刊:是
出版信息:
出版地区:UNITED STATES
出版商:Institute of Electrical and Electronics Engineers Inc.
出版语言:English
出版周期:Bimonthly
出版年份:1975
研究方向:工程技术-工程:电子与电气
评价信息:
影响因子:6.5
H-index:151
CiteScore指数:9.7
SJR指数:1.868
SNIP指数:2.591
发文数据:
Gold OA文章占比:18.37%
研究类文章占比:98.52%
年发文量:271
自引率:0.1081...
开源占比:0.1292
出版撤稿占比:0
出版国人文章占比:0.12
OA被引用占比:0
英文简介 期刊介绍 CiteScore数据 中科院SCI分区 JCR分区 发文数据 常见问题

英文简介Ieee Transactions On Software Engineering期刊介绍

The IEEE Transactions on Software Engineering is interested in well-defined theoretical results and empirical studies that have potential impact on the construction, analysis, or management of software. The scope of this Transactions ranges from the mechanisms through the development of principles to the application of those principles to specific environments. Specific topic areas include: a) development and maintenance methods and models, e.g., techniques and principles for the specification, design, and implementation of software systems, including notations and process models; b) assessment methods, e.g., software tests and validation, reliability models, test and diagnosis procedures, software redundancy and design for error control, and the measurements and evaluation of various aspects of the process and product; c) software project management, e.g., productivity factors, cost models, schedule and organizational issues, standards; d) tools and environments, e.g., specific tools, integrated tool environments including the associated architectures, databases, and parallel and distributed processing issues; e) system issues, e.g., hardware-software trade-off; and f) state-of-the-art surveys that provide a synthesis and comprehensive review of the historical development of one particular area of interest.

期刊简介Ieee Transactions On Software Engineering期刊介绍

《Ieee Transactions On Software Engineering》自1975出版以来,是一本计算机科学优秀杂志。致力于发表原创科学研究结果,并为计算机科学各个领域的原创研究提供一个展示平台,以促进计算机科学领域的的进步。该刊鼓励先进的、清晰的阐述,从广泛的视角提供当前感兴趣的研究主题的新见解,或审查多年来某个重要领域的所有重要发展。该期刊特色在于及时报道计算机科学领域的最新进展和新发现新突破等。该刊近一年未被列入预警期刊名单,目前已被权威数据库SCIE收录,得到了广泛的认可。

该期刊投稿重要关注点:

Cite Score数据(2024年最新版)Ieee Transactions On Software Engineering Cite Score数据

  • CiteScore:9.7
  • SJR:1.868
  • SNIP:2.591
学科类别 分区 排名 百分位
大类:Computer Science 小类:Software Q1 60 / 407

85%

CiteScore 是由Elsevier(爱思唯尔)推出的另一种评价期刊影响力的文献计量指标。反映出一家期刊近期发表论文的年篇均引用次数。CiteScore以Scopus数据库中收集的引文为基础,针对的是前四年发表的论文的引文。CiteScore的意义在于,它可以为学术界提供一种新的、更全面、更客观地评价期刊影响力的方法,而不仅仅是通过影响因子(IF)这一单一指标来评价。

历年Cite Score趋势图

中科院SCI分区Ieee Transactions On Software Engineering 中科院分区

中科院 2023年12月升级版 综述期刊:否 Top期刊:是
大类学科 分区 小类学科 分区
计算机科学 1区 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 1区 1区

中科院分区表 是以客观数据为基础,运用科学计量学方法对国际、国内学术期刊依据影响力进行等级划分的期刊评价标准。它为我国科研、教育机构的管理人员、科研工作者提供了一份评价国际学术期刊影响力的参考数据,得到了全国各地高校、科研机构的广泛认可。

中科院分区表 将所有期刊按照一定指标划分为1区、2区、3区、4区四个层次,类似于“优、良、及格”等。最开始,这个分区只是为了方便图书管理及图书情报领域的研究和期刊评估。之后中科院分区逐步发展成为了一种评价学术期刊质量的重要工具。

历年中科院分区趋势图

JCR分区Ieee Transactions On Software Engineering JCR分区

2023-2024 年最新版
按JIF指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 9 / 131

93.5%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 40 / 352

88.8%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 6 / 131

95.8%

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 19 / 354

94.77%

JCR分区的优势在于它可以帮助读者对学术文献质量进行评估。不同学科的文章引用量可能存在较大的差异,此时单独依靠影响因子(IF)评价期刊的质量可能是存在一定问题的。因此,JCR将期刊按照学科门类和影响因子分为不同的分区,这样读者可以根据自己的研究领域和需求选择合适的期刊。

历年影响因子趋势图

发文数据

2023-2024 年国家/地区发文量统计
  • 国家/地区数量
  • USA59
  • CHINA MAINLAND41
  • Canada33
  • England26
  • Italy23
  • Australia20
  • GERMANY (FED REP GER)17
  • Singapore15
  • Luxembourg9
  • Netherlands9

本刊中国学者近年发表论文

  • 1、A Large-Scale Empirical Study of Real-Life Performance Issues in Open Source Projects

    Author: Zhao, Yutong; Xiao, Lu; Bondi, Andre B.; Chen, Bihuan; Liu, Yang

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 924-946. DOI: 10.1109/TSE.2022.3167628

  • 2、Pull Request Decisions Explained: An Empirical Overview

    Author: Zhang, Xunhui; Yu, Yue; Gousios, Georgios; Rastogi, Ayushi

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 849-871. DOI: 10.1109/TSE.2022.3165056

  • 3、Web APIs: Features, Issues, and Expectations - A Large-Scale Empirical Study of Web APIs From Two Publicly Accessible Registries Using Stack Overflow and a User Survey

    Author: Zhang, Neng; Zou, Ying; Xia, Xin; Huang, Qiao; Lo, David; Li, Shanping

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 498-528. DOI: 10.1109/TSE.2022.3154769

  • 4、ErrHunter: Detecting Error-Handling Bugs in the Linux Kernel Through Systematic Static Analysis

    Author: Zhan, Dongyang; Yu, Xiangzhan; Zhang, Hongli; Ye, Lin

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 684-698. DOI: 10.1109/TSE.2022.3160155

  • 5、Off to a Good Start: Dynamic Contribution Patterns and Technical Success in an OSS Newcomer's Early Career

    Author: Yue, Yang; Wang, Yi; Redmiles, David

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 529-548. DOI: 10.1109/TSE.2022.3156071

  • 6、A Procedure to Continuously Evaluate Predictive Performance of Just-In-Time Software Defect Prediction Models During Software Development

    Author: Song, Liyan; Minku, Leandro L.

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 646-666. DOI: 10.1109/TSE.2022.3158831

  • 7、Inconsistent Defect Labels: Essence, Causes, and Influence

    Author: Liu, Shiran; Guo, Zhaoqiang; Li, Yanhui; Wang, Chuanqi; Chen, Lin; Sun, Zhongbin; Zhou, Yuming; Xu, Baowen

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 586-610. DOI: 10.1109/TSE.2022.3156787

  • 8、Large-Scale Empirical Study of Inline Assembly on 7.6 Million Ethereum Smart Contracts

    Author: Liao, Zhou; Song, Shuwei; Zhu, Hang; Luo, Xiapu; He, Zheyuan; Jiang, Renkai; Chen, Ting; Chen, Jiachi; Zhang, Tao; Zhang, Xiaosong

    Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 777-801. DOI: 10.1109/TSE.2022.3163614

投稿常见问题

通讯方式:IEEE COMPUTER SOC, 10662 LOS VAQUEROS CIRCLE, PO BOX 3014, LOS ALAMITOS, USA, CA, 90720-1314。