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Microelectronics Journal

Microelectronics JournalSCIE

国际简称:MICROELECTRON J  参考译名:微电子杂志

  • 中科院分区

    3区

  • CiteScore分区

    Q2

  • JCR分区

    Q3

基本信息:
ISSN:0026-2692
E-ISSN:1879-2391
是否OA:未开放
是否预警:否
TOP期刊:否
出版信息:
出版地区:ENGLAND
出版商:Elsevier
出版语言:English
出版周期:Monthly
出版年份:1967
研究方向:工程技术-工程:电子与电气
评价信息:
影响因子:1.9
H-index:59
CiteScore指数:4
SJR指数:0.39
SNIP指数:0.854
发文数据:
Gold OA文章占比:2.61%
研究类文章占比:99.32%
年发文量:293
自引率:0.2727...
开源占比:0.0103
出版撤稿占比:0
出版国人文章占比:0
OA被引用占比:0.0096...
英文简介 期刊介绍 CiteScore数据 中科院SCI分区 JCR分区 发文数据 常见问题

英文简介Microelectronics Journal期刊介绍

Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.

The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.

Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.

期刊简介Microelectronics Journal期刊介绍

《Microelectronics Journal》自1967出版以来,是一本工程技术优秀杂志。致力于发表原创科学研究结果,并为工程技术各个领域的原创研究提供一个展示平台,以促进工程技术领域的的进步。该刊鼓励先进的、清晰的阐述,从广泛的视角提供当前感兴趣的研究主题的新见解,或审查多年来某个重要领域的所有重要发展。该期刊特色在于及时报道工程技术领域的最新进展和新发现新突破等。该刊近一年未被列入预警期刊名单,目前已被权威数据库SCIE收录,得到了广泛的认可。

该期刊投稿重要关注点:

Cite Score数据(2024年最新版)Microelectronics Journal Cite Score数据

  • CiteScore:4
  • SJR:0.39
  • SNIP:0.854
学科类别 分区 排名 百分位
大类:Physics and Astronomy 小类:Condensed Matter Physics Q2 181 / 434

58%

大类:Physics and Astronomy 小类:Electrical and Electronic Engineering Q2 332 / 797

58%

大类:Physics and Astronomy 小类:Atomic and Molecular Physics, and Optics Q2 101 / 224

55%

大类:Physics and Astronomy 小类:Surfaces, Coatings and Films Q2 61 / 132

54%

大类:Physics and Astronomy 小类:Electronic, Optical and Magnetic Materials Q2 133 / 284

53%

CiteScore 是由Elsevier(爱思唯尔)推出的另一种评价期刊影响力的文献计量指标。反映出一家期刊近期发表论文的年篇均引用次数。CiteScore以Scopus数据库中收集的引文为基础,针对的是前四年发表的论文的引文。CiteScore的意义在于,它可以为学术界提供一种新的、更全面、更客观地评价期刊影响力的方法,而不仅仅是通过影响因子(IF)这一单一指标来评价。

历年Cite Score趋势图

中科院SCI分区Microelectronics Journal 中科院分区

中科院 2023年12月升级版 综述期刊:否 Top期刊:否
大类学科 分区 小类学科 分区
工程技术 3区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 3区 4区

中科院分区表 是以客观数据为基础,运用科学计量学方法对国际、国内学术期刊依据影响力进行等级划分的期刊评价标准。它为我国科研、教育机构的管理人员、科研工作者提供了一份评价国际学术期刊影响力的参考数据,得到了全国各地高校、科研机构的广泛认可。

中科院分区表 将所有期刊按照一定指标划分为1区、2区、3区、4区四个层次,类似于“优、良、及格”等。最开始,这个分区只是为了方便图书管理及图书情报领域的研究和期刊评估。之后中科院分区逐步发展成为了一种评价学术期刊质量的重要工具。

历年中科院分区趋势图

JCR分区Microelectronics Journal JCR分区

2023-2024 年最新版
按JIF指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 211 / 352

40.2%

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q4 110 / 140

21.8%

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 238 / 354

32.91%

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 94 / 140

33.21%

JCR分区的优势在于它可以帮助读者对学术文献质量进行评估。不同学科的文章引用量可能存在较大的差异,此时单独依靠影响因子(IF)评价期刊的质量可能是存在一定问题的。因此,JCR将期刊按照学科门类和影响因子分为不同的分区,这样读者可以根据自己的研究领域和需求选择合适的期刊。

历年影响因子趋势图

本刊中国学者近年发表论文

  • 1、16-Cell stackable battery monitoring and management integrated circuit for electric vehicles

    Author: Zhu, Guangqian; Qian, Libo; Li, Yongyuan; Guo, Wei; Ding, Ruixue; Yang, Yintang

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 136, Issue , pp. -. DOI: 10.1016/j.mejo.2023.105782

  • 2、A wafer-level three-step calibration technique for BJT-based CMOS temperature sensor

    Author: Gao, Ying; Liu, Xin; Jiang, Yanfeng

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105671

  • 3、Scalable modeling of grounded coplanar waveguide for MMICs design using neural network with an effective sampling strategy

    Author: Hu, Yanghui; Zhang, Yuming; Lu, Hongliang; Tan, Daidao; Qi, Junjun

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105670

  • 4、A configurable area-efficient LCoS chip design with centrosymmetric pixel array

    Author: Zhao, Tianhu; Liang, Yuhua; Feng, Lichen

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105652

  • 5、On-chip SRR and CSRR for millimeter-wave integrated systems: Review and applications

    Author: Yang, Ke; Liang, Yuan; Zhang, Hao Chi; Feng, Guangyin

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105664

  • 6、A 10-MHz 85.1-dB SFDR 1.1-mW continuous-time Delta-sigma modulator employing calibration-free SC DAC and passive front-end low-pass filter

    Author: Jin, Wei; Pun, Kong-Pang

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105666

  • 7、CMOS variable-gain phase shifter based on time-varying vector-sum method and its application to Ku-band phased array

    Author: Cheng, Guoxiao; Zhang, Jin-Dong; Chen, Qiaoyu; Sima, Boyu; Wu, Wen

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105672

  • 8、A novel-16-60 V input common-mode voltage current-shunt monitor?

    Author: Duan, Quanzhen; Duan, Ying; Kong, Dameng; Li, Liwei; Huang, Shengming

    Journal: MICROELECTRONICS JOURNAL. 2023; Vol. 131, Issue , pp. -. DOI: 10.1016/j.mejo.2022.105663

投稿常见问题

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